After receiving criticism for the overheating issues as well as the quality control of their previous SoCs, Qualcomm and MediaTek announced in a report that they have ended their partnership with Samsung and will move forward with TSMC (Taiwan Semiconductor Manufacturing Company) to manufacture just for the Snapdragon 8 series.
That’s because after switching from Samsung’s 4nm foundry to TSMC’s 4nm semiconductor production foundry, the latest Qualcomm Snapdragon 8+ Gen 1 SoC showed better CPU performance along with more power and thermal efficiencies than predecessors released by Samsung.
According to a Weibo post, there will be 4 SoCs for smartphones manufactured by TSMC: Qualcomm Snapdragon 8 Gen 2, MediaTek Dimensity 9100, Qualcomm Snapdragon 7 Gen 2 and MediaTek Dimensity 8200. The idea is that Snapdragon 8 Gen 2 is faster than MediaTek Dimensity 9100 on TSMC, while the development of Qualcomm Snapdragon 7 Gen 2 is faster than MediaTek Dimensity 8200 on TSMC.
It is estimated that the Snapdragon 8 Gen 2 and the Dimensity 9100 SoC will compose Android devices that will be announced in 2023. In the case of the Snapdragon 7 Gen 2 and MediaTek Dimensity 8200, the devices in the Android market will be of more secondary lines.
According to the report, the Snapdragon 7 Gen 2 should be an iterative upgrade over the Snapdragon 7 Gen 1, with little to no changes to the core layout or ISPs. Currently, it is possible to find the Snapdragon 7 Gen 1 in only one smartphone on the market, the China-exclusive Oppo Reno 8 Pro, possibly because many customers, such as Android smartphone manufacturers, are looking for the Snapdragon 778G and 778G+, which are under the casting. of 6 nm from TSMC.
And you, do you have any comments about the quality of the Socs manufactured by Samsung? Leave your comment!